The thickness standard of terminal plating usually depends on the specific application and industry standards. Different industries and uses may have different requirements.
Functions
1) Conductivity: It can increase the conductivity of metal terminals and ensure better current conduction.
2) Corrosion Resistance: Metal terminals are susceptible to oxidation and corrosion, and terminal plating can provide a protective metal surface to prevent the terminals from being corroded by moisture, chemicals, etc.
3) Connection Stability: It can improve the stability of the connection, reduce possible contact problems during connection, and ensure the reliability of signal transmission.
4) Improve Appearance: It can improve the appearance of the terminal, making it look smoother and more uniform.
Plating Materials1) Gold: The thickness is usually between a few microns (um) and tens of microns, depending on the requirements of the application. Generally speaking, the thicker the metal, the better its conductivity and corrosion resistance.
2) Silver: Similar to gold, silver is also a common plating material. The thickness range can be similar to gold, depending on the specific application.
3) Tin: Commonly used in some connectors and electronic components, the plating thickness of tin is usually between a few microns and tens of microns.
4) Nickel: As a plating layer for the bottom or middle layer, it usually has a larger thickness. 5) Alloy: The terminal of the alloy may have a specific alloy composition, and its thickness standard will vary depending on the type of alloy. For example, some alloys containing zinc may be used in some applications, and their thickness will also range from a few microns to tens of microns.
Measurement and Calculation
1) Electronic Thickness Gauge Measurement: Generally used to measure the thickness of the surface of a metal or alloy. It uses the principle of electromagnetic induction to determine the thickness of the plating by sending electromagnetic waves and measuring the characteristics of the reflected waves. This is a non-destructive measurement method.
2) X-ray Fluorescence: Another method for measuring the thickness of a metal surface. It uses X-rays to irradiate the surface of the sample and then determines the thickness of the plating by measuring the energy of the fluorescent radiation.
3) Microscopic Measurement: This method involves observing the cross section with a microscope and determining the thickness by measuring the boundary between the plating and the substrate. This method usually needs to be performed in a laboratory environment.
4) Calculation Formula: A common calculation formula is: plating thickness = mass of the plating/(density of the plating x area of the substrate). The density of the coating refers to the density of the coating material, and the mass can be obtained by weighing or other methods. The area of the substrate refers to the surface area covered by the coating.
